1.Temporary fixation of electronic components to avoid scratches and damage to the product

2.Exquisite and fragile chip processing; Positioning and cutting of MLCC chip capacitors and chip inductors in the manufacturing process

3.Semiconductor chip surface processing; Manufacturing and processing engineering of electronic and optoelectronic industry components

4.Perform wafer cutting or substrate cutting for semiconductor wafer factories; Back grinding; Protective film used in the thinning process to protect surface circuits

5.LCD and TP touch panel glass thinning, grinding and polishing

6.LED cutting, grinding and polishing; Thin Grinding Process for Sapphire Substrates

7.Copper substrate graphene transfer printing and nanocarbon tube transfer printing can replace UV blue film for use

Product Features

1.Has adhesive strength at room temperature

2.Heating and disappearance of adhesive force

3.Easy to peel off after heating

4.During peeling, there is no residue of adhesive and it will not cause damage to the adhesive body

5.Non stick knife edge