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3M 9077 tape is known for its excellent heat resistance, adhesion and easy processing, and is widely used in the bonding and fixing of flexible circuit boards (FPC) and other applications in high temperature environments. The tape uses a special non-woven fabric as the base material, combined with a high-temperature acrylic adhesive, to achieve stable adhesion under high temperature conditions.
1. It can be used for bonding flexible circuit boards, with good heat shock resistance and excellent bonding performance for plastics and plastic gaskets. It has excellent heat shock resistance and can be used in high-temperature lead-free processes. Its release paper can also be reflowed, and it also has the characteristics of low volatility and easy die-cutting. For example: bonding of flexible circuit boards (over-high-temperature reflow)
2. The release paper will not be carbonized after reflowing at 300 degrees Celsius, which meets the requirements of the lead-free industry
3. Double-sided adhesive tape with adhesive and peeling layer that can withstand the high temperature of lead-free soldering process (300℃).
4. Used to fix FPC and reinforcing board, FPC and frame.
| Specification/Feature | 3M 9077 Tape |
|---|---|
| Product Name | 3M 9077 Double-Sided Tape |
| Thickness | 0.05MM (0.002in.) |
| Substrate | Special Non-woven White Tissue |
| Temperature Resistance | Short-term: 263℃, Long-term: 149℃ |
| Application | High-temperature lead-free processes |
| Adhesive Type | Double-coated, High-temperature Acrylic Adhesive |
| Material Type | Tissue |
| Comparable Products | 3M 9079 (for high-temperature lead-free processes) |
| Other Notes | Suitable for use in flexible circuit board (FPC) bonding and other high-temperature applications |
Features
1. High temperature release liner that can be removed from a typical lead-free reflow soldering process with a peak temperature up to 500°F (260°C).
2. Ideal for attachment of flexible printed circuits (PCBs) in many areas of electronic products subject to high temperature processing and operating environments.
3. Release after lead-free reflow.
4. High adhesion, good holding power and low outgassing.
Specification data
